Development of 3-D Printed Hybrid Packaging for GaAs-MEMS Oscillators based on Piezoelectrically-Transduced ZnO-on-SOI Micromechanical Resonators
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Development of 3-D Printed Hybrid Packaging for GaAs-MEMS Oscillators based on Piezoelectrically-Transduced ZnO-on-SOI Micromechanical Resonators